Paste application method for die bonding

ABSTRACT

A paste applicator and paste application method for die bonding apply paste to adhere a semiconductor chip on a substrate. Data on paste application volume and application pattern which can be identified from paste thickness and chip size are stored. A dispensing flow rate calculator calculates dispensing flow rate of a dispenser based on the paste application volume data and application pattern data when the paste is dispensed from the dispenser and pressure fed to an application nozzle for applying paste. Based on this calculated dispensing flow rate and application pattern data, a dispenser controller controls the dispenser and a transfer table controller controls the transfer table for moving the application nozzle.

FIELD OF THE INVENTION

The present invention relates to the field of paste applicators andpaste application methods for applying paste onto substrates such aslead frames for die bonding.

BACKGROUND OF THE INVENTION

In the die bonding process used in the manufacture of semiconductordevices, paste is applied to a substrate such as a lead frame forattaching semiconductor chips. The paste is applied to an applicationarea on the substrate by dispensing the paste from a dispenser to anapplication nozzle, and then onto the substrate. One known applicationmethod is plotting, in which paste is applied by moving the applicationnozzle in the application area while dispensing the paste.

Since the volume of paste required varies according to the types andsizes of target chips, application patterns including plotting patternsand application nozzle moving speed patterns need to be set for eachtarget chip before plotting can be carried out. However, conventionalpaste applicators require a painstaking process for setting applicationpatterns every time in the above plotting application, involvingcomplicated data input. In addition, if patterns are not appropriatelyset, the required application quality may not be achieved.

SUMMARY OF THE INVENTION

A paste applicator for die bonding of the present invention appliespaste onto a substrate for attaching a semiconductor chip on thesubstrate, and includes an application nozzle which dispenses paste froman application opening to apply the paste on the substrate; a transfertable for moving the application nozzle relative to the substrate; adispenser which dispenses the paste for pressure feeding the paste tothe application nozzle; a dispensing flow rate calculator forcalculating the dispensing flow rate of the dispenser based on data onvolume of the paste to be applied to the substrate and data onapplication pattern; and a controller for controlling the dispenser andtransfer table based on calculated flow rate and the data on applicationpattern for applying the paste.

A paste application method for die bonding of the present inventionapplies paste for attaching a semiconductor chip on the substrate bypressure feeding the paste dispensed from the dispenser to theapplication nozzle and then dispensing the paste from the applicationopening of the application nozzle. The dispensing flow rate calculatorcalculates the dispensing flow rate of the dispenser based on data onamount of paste to be applied to the substrate and data on applicationpattern, and controls the transfer table for moving the dispenser andapplication nozzle based on this calculated dispensing flow rate anddata on the application pattern.

The present invention improves operability and secures applicationquality by calculating the dispensing flow rate of the dispenser basedon data on volume of paste to be applied to the substrate and data onthe application pattern with the dispense flow rate calculator, andcontrolling the transfer table which moves the dispenser and applicationnozzle based on this calculated dispensing flow rate and data on theapplication pattern.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a die bonder in accordance with apreferred embodiment of the present invention.

FIG. 2 is a sectional view of a dispenser for dispensing paste inaccordance with the preferred embodiment of the present invention.

FIG. 3A is a sectional view of a past application nozzle in accordancewith the preferred embodiment of the present invention.

FIG. 3B is a sectional view of a paste application nozzle in accordancewith the preferred embodiment of the present invention.

FIG. 4 is a block diagram illustrating a control system of a die bonderin accordance with the preferred embodiment of the present invention.

FIG. 5 is a block diagram illustrating a paste application function of adie bonder in the preferred embodiment of the present invention.

FIG. 6 is an explanatory diagram for a paste application pattern inaccordance with the preferred embodiment of the present invention.

FIG. 7 is an explanatory diagram illustrating the state of a bonded chipin accordance with the preferred embodiment of the present invention.

FIG. 8A is an explanatory diagram for a paste application pattern inaccordance with the preferred embodiment of the present invention.

FIG. 8B is an explanatory diagram for a paste application pattern inaccordance with the preferred embodiment of the present invention.

FIG. 8C is an explanatory diagram for a paste application pattern inaccordance with the preferred embodiment of the present invention.

FIG. 8D is an explanatory diagram for a paste application pattern inaccordance with the preferred embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENT

A paste applicator and paste application method for die bonding inaccordance with a preferred embodiment of the present invention aredescribed below with reference to FIGS. 1 to 8D.

First, a configuration of a die bonder in the preferred embodiment ofthe present invention is described with reference to FIG. 1. In FIG. 1,a wafer sheet 2 is placed on a chip feeder 1 by means of a holding table(not illustrated). Many chips 3, which are semiconductor devices, areattached to the wafer sheet 2. A carrier 5 is disposed at the side ofthe chip feeder 1. The carrier 5 transports a lead frame 6, which is asubstrate, and positions the lead frame 6 in the paste applicationposition and bonding position. A bonding head 4 is disposed above thechip feeder 1. The bonding head 4 moves horizontally or vertically bymeans of a transfer mechanism which is not illustrated in FIG. 1.

A paste application unit 9 is disposed at the side of the carrier 5. Thepaste application unit 9 includes an application nozzle 18 attached tothe transfer table 10 with an L bracket 15. A flexible tube 17 connectsthe application nozzle 18 to a dispenser 16 mounted on a fixed plate 21.An air tube 20 also connects the application nozzle 18 to a dispensingcontrol valve 19. When the dispenser 16 is driven, the paste is pressurefed to the application nozzle 18 through the tube 17. The paste is thendispensed from the application opening provided at the lower end of theapplication nozzle 18 onto an application area 6 a of the lead frame 6.The dispensing control valve 19 controls the period of dispensing thepaste from the application nozzle 18.

The transfer table 10 includes an X axis table 12 on a Y axis table 11,and a Z axis table 14 is vertically connected to the X axis table 12with an L bracket 13. The Y axis table 11, X axis table 12, and Z axistable 14 respectively have a Y axis motor 11 a, X axis motor 12 a, and Zaxis motor 14 a. The application nozzle 18 moves horizontally orvertically over the lead frame 6 by driving the X axis motor 12 a, Yaxis motor 11 a, and Z axis motor 14 a. Accordingly, the transfer table10 moves the application nozzle 18 relative to the lead frame 6.

A chip bonding area 6 a of the chip 3 on an upper face of the lead frame6 on which the chip will be bonded is the application area 6 a where thepaste is applied. The application nozzle 18 is positioned in theapplication area 6 a, and moves while dispensing the paste for applyingpaste 7 in a cross mark application pattern to the application area 6 aof a target chip placed on the surface of the lead frame 6.

After applying the paste, the lead frame 6 is transferred on the carrier5 to a bonding position 8, and is positioned. A nozzle 4 a of thebonding head 4 picks up the chip 3 from the chip feeder 1, and places iton the paste 7 applied in the application area 6 a for bonding the chip3.

Next, a configuration of the dispenser 16 in the preferred embodiment ofthe present invention is described with reference to FIG. 2. In FIG. 2,a syringe 26 which is a container for storing the paste 7 is mounted onan upper face of a manifold block 25. A lower end 26 a of the syrnge 26is fitted into an inner hole 27 created on the manifold block 25. Insidethe syringe 26 is thus linked to space 27 a. A horizontal inner hole 27b is linked to the space 27 a, and the inner hole 27 b is linked tospace 31.

A reciprocating mechanism 28, working in reciprocating fashion, insertsa stem 29 into the space 27 a. An end of the inner hole 27 b is closedwith a sealing face 29 a by protruding the stem 29. The stem 29 andinner hole 27 a compose the first valve V1. The sliding face of the stem29 is sealed with a sealing member 30 to prevent the leaked paste 7 fromthe syringe 26 to the space 27 a from flowing outside.

A piston 32 is fitted into an inner hole 31 a created on the manifoldblock 25 and is inserted to the space 31. The sliding face of the piston32 is sealed with a sealing member 33. The piston 32 is held with aholding member 34, and the piston 32 moves in and out of the space 31 byreciprocating the holding member 34 with a reciprocating unit includinga motor 35, feeding screw 36, and nut 37. Other configurations for thereciprocating unit are acceptable as long as the position or speed ofthe piston 32 is controllable. A dispensing opening 42 is providedperpendicular to an inner hole 31 b provided below the space 31. A stem40 is fitted in reciprocating fashion by a reciprocating mechanism 39 toan inner hole 38 provided perpendicularly to the inner hole 31 b. Thesliding face of the stem 40 is sealed with a sealing member 41. Asealing face 40 a closes the dispensing opening 42 when the stem 40 isprotruded. The stem 40 and dispensing opening 42 compose a valve V2.

The operation of the dispenser 16 is described next. First, an intakingprocess of filling the space 31 with the paste 7 in the syringe 26 bysuction is described. The stem 40 is first protruded to close the secondvalve V2, and then the stem 29 is retracted to open the first valve V1.In this state, the piston 32 is pulled for intaking the paste 7. Here,the pressure is applied to the paste 7 by supplying air from an airsource 43 to the syringe 26 through a control valve 44. In line with thepulling of the piston 32, the paste 7 flows to the space 27 a, innerhole 27 b, and reaches the space 31. Since the second valve V2 isclosed, the space 31 is filled with the paste 7

Next, the paste dispensing process is described. In the above state, thefirst valve V1 is closed, the second valve V2 is opened, and the piston32 is inserted to the space 31. This operation pushes out the paste 7 inthe space 31 through the inner hole 31 b, and the paste 7 is dischargedfrom the dispensing opening 42. By repeating the above intaking anddispensing processes, the paste in the syringe 26 is intermittentlyfilled into the space 31 and dispensed out from the dispensing opening42. The dispensed paste 7 is pressure fed to the application nozzle 18through the tube 17. Here, a dispensing flow rate, which is thedispensing volume per unit time, is adjustable by controlling therevolution of the motor 35 to control the operating speed of the piston32.

Next, the application nozzle 18 in the preferred embodiment of thepresent invention is described below with reference to FIGS. 3A and 3B.As shown in FIGS. 3A and 3B, a nozzle block 18 a is an approximatelycylindrical member whose lower part is processed into a cone shape. Astepped inner hole 53 is provided at the center of the cylinder alongthe shaft direction. A valve stem 54 is fitted into the inner hole 53 invertically movable fashion. An upper part of the inner hole 53 isconnected to a cylinder 50 where a piston 54 a at an upper end of thevalve stem 54 is fitted. A spring 52 applies an upward force to thepiston 54 a. Air is supplied from the air tube 20 through a joint 51into the cylinder 50 which is closed with a cover member 18 b providedon the nozzle block 18 a. This air supply applies pressure to the piston54 a to lower the valve stem 54, counteracting the force of the spring52.

The tube 17 in which the paste 7 is pressure fed through a joint 55 isconnected to first space 53 a provided at the middle part of the nozzleblock 18 a. The first space 53 a is connected to a second space 56provided immediately in front of an application opening 57 whichdispenses the paste 7 for application through a clearance 53 b throughwhich the valve stem 54 passes. The valve stem 54 stretches downward andreaches the second space 56. A tapered sealing face 54 b is provided ata lower part of the valve stem 54. As shown in FIG. 3B, the sealing face54 b contacts a valve sheet 53 c provided at a lower end of theclearance 53 b for closing the lower end of the clearance 53 b.

As shown in FIG. 3A, the valve stem 54 is at its lower position when thecylinder 50 is pressurized. The paste 7 pressure fed through the tube 17is thus dispensed from the dispensing opening 57 through the first space53 a, clearance 53 b, and second space 56. Also as shown in FIG. 3B, thestem 54 is at its uppermost position when the pressure applied to thecylinder 50 is released. The valve sheet 53 c then closes the clearance53 b to stop dispensing of the paste 7. In other words, the valve stem54 and valve sheet 53 c are provided integrally with the applicationnozzle 18, and form an opening unit to open and close the applicationopening 57.

A control system of the die bonder in the preferred embodiment of thepresent invention is described next with reference to FIG. 4. In FIG. 4,a dispenser controller 60 controls the motor 35 which drives the piston32 and the reciprocating mechanisms 28 and 39 which respectively drivethe first and second valves to control dispensing of the paste by thedispenser 16. A dispensing control valve driver 61 controls air suppliedto the cylinder 50 of the application nozzle 18 by driving the openingand closing of the dispensing control valve 19 that in turn opens andcloses the opening unit of the application nozzle 18.

A Z axis motor driver 62, Y axis motor driver 63, and X axis motordriver 64 respectively drive the Z axis motor 14 a, Y axis motor 11 a,and X axis motor 12 a of the transfer table 10 (FIG. 1). A bonding headdriver 65 drives the bonding head 4 which bonds the chip 3 (FIG. 1). Amemory 66 stores the programs which are used for operating andprocessing of each unit and data on application patterns. A controller67 controls the operation of each unit based on programs stored in thememory 66. A control panel 68 is an input unit such as a keyboard ormouse for inputting control commands and data. A display 69 is a displaydevice for displaying input operations on a screen.

Functions of the die bonder in the paste application process isdescribed with reference to FIG. 5. In FIG. 5, blocks 70, 76, and 78configure a first memory, application pattern setting unit, and secondmemory. In the elements shown in FIG. 5, an application volumecalculator 75, application pattern setting unit 76, input processor 77,display processor 82, dispensing flow rate calculator 83, applicationspeed calculator 84, evaluation unit 85, and transfer table controller86 are handled with the controller 67 shown in FIG. 4. The first memory70 and second memory 78 indicate data stored in the memory 66 in FIG. 4.

First, each part configuring the first memory 70 is described. A nozzlesize data memory 71 stores data on sizes of the application opening 57(FIGS. 3A and 3B) which is provided at the lower end of the applicationnozzle 18 and dispenses the paste. In other words, data such as diameteror sectional area of the application opening 57 is stored. This data isused for calculating the application speed of paste dispensed from theapplication nozzle 18. A paste thickness data memory 72 stores thethickness of paste TP (FIG. 7) between the bonded lead frame 6 and chip3 for each target chip. This data is used for calculating volume ofpaste which is desirably applied to each application area.

A chip size data memory 73 stores data on sizes of target chips. Inother words, data on the width and length of the chip 3 is stored. Thisdata is used for calculating application volume, and also as a referencefor selecting an application pattern. An application pattern data memory74 stores application patterns of the paste to be applied to theapplication area. In other words, it stores two or more applicationpatterns indicating reference coordinates data 74 a of applicationpoints and application lines and a reference speed pattern 74 b in atravel path of the application nozzle 18. FIGS. 8A to 8D show examplesof application patterns.

An appropriate application pattern is selected from these pluralapplication patterns based on the chip size and shape (e.g. rectangularor square) at applying the paste.

The input processor 77 processes operation input signals input from thecontrol panel 68, and outputs control commands to each unit, and writesdata to the first memory 70. The application volume calculator 75calculates volume of the paste to be applied to each application areabased on the paste thickness data and chip size data stored in the firstmemory 70. The application volume is calculated by identifying aprojected plan area of a chip from the chip size data and multiplyingthis area by the paste thickness TP indicated in FIG. 7 and a correctionfactor. Calculation results are stored in an application volume memory79 in the second memory 78.

The application pattern setting unit 76 includes an application patternselector 76 b and magnifying and reducing processor 76 a. Theapplication pattern setting unit 76 selects an application pattern, andmatches the selected application pattern with the size of the targetchip. More specifically, the application pattern selector 76 b selectsan appropriate application pattern from several application patternsstored in the application pattern data memory 74 based on the chip sizedata, and the magnifying and reducing processor 76 a implements thedesired changes, including magnification and reduction, to match theactual chip size. The magnification and reduction process makes itpossible to store only basic reference application patterns, making itpossible to handle a variety of chip models using a small portion ofreference patterns.

Based on the setting of application patterns, data on applicationpatterns required for controlling actual application operation, i.e.,coordinates data c for specifying each application point and applicationline, a speed pattern v, i.e., the speed on the travel path of theapplication nozzle 18 moving among application points and applicationlines, and application time t indicating the time for actuallydispensing and applying the paste on the travel path are calculated.

In these sets of data on application patterns, the coordinates data cand speed pattern v are stored respectively in the coordinates datamemory 81 b and in the speed pattern memory 81 a provided in theapplication pattern memory 81 in the second memory 78. Signals oncoordinates data and speed pattern are output to the transfer tablecontroller 86, and the transfer table controller 86 controls the X axismotor driver 64, Y axis motor driver 63, and Z axis motor driver 62based on the coordinates data and speed pattern. Accordingly, theapplication nozzle 18 moves with the transfer table 10 along the travelpath of the application pattern.

Data on application time t in the application patterns is used forcalculating dispensing flow rate by the dispensing flow rate calculator83. In other words, the dispensing flow rate calculator 83 calculatesthe dispensing flow rate which is the dispensed volume per unit timerequired for the dispenser 16 by dividing the application volume storedin the application volume memory 79 by the application time t. Thedispensing flow rate calculator 83 thus calculates the dispensing flowrate of the dispenser 16 (FIG. 2) based on data on the applicationvolume of the paste and the data on application pattern.

These calculation results are stored in a dispensing flow rate memory80. Stored data on dispensing flow rate is sent to the dispensercontroller 60 (see FIG. 4). The dispenser controller 60 controls themotor 35 for the dispenser 16 in accordance with this dispensing flowrate data for dispensing the paste from the dispensing opening 42 of thedispenser 16 at the predetermined dispensing flow rate. Accordingly, thedispenser controller 60 and the transfer table controller 86 control thedispenser 16 and transfer table 10 in accordance with data on dispensingflow rate and application pattern.

The application speed calculator 84 calculates application speed u whichis the speed of paste dispensed from the application opening 57 of theapplication nozzle 18 based on the data on dispensing flow rate andnozzle size data which express the size of the application nozzle 18.This calculation result is sent to the evaluation unit 85 to determinewhether the calculated application speed u conforms to the transferspeed of the application nozzle 18 under operation.

More specifically, if the application speed u of the paste dispensedfrom the application opening 57 of the application nozzle 18 is lowerthan the transfer speed of the application nozzle 18, dispensing ofpaste is slower than the transfer of nozzle, causing defectiveapplication such as smearing of the application line. The speed patternmemory 81 a thus extracts the maximum transfer speed Vmax from thestored speed patterns and compare this Vmax with the application speed uto evaluate conformance. The evaluation results are sent to the displayprocessor, and results are displayed on the display 69.

Other than displaying the evaluation results, the display processor 82processes data stored in the second memory 78, and displays data usedfor actual application in a predetermined display format on the display69. This enables the operator to always monitor application conditionsfor actual operation.

The die bonder is configured as described above. Next, paste applicationby the die bonder is described with reference to FIG. 6. In FIG. 6, afirst application line L1 and second application line L2 composing thecross mark application pattern is set on the application area 6 a on thelead frame 6. Each position of the first and second application lines L1and L2 are identified by application start points PS (1) and PS (2), andapplication end points PE (1) and PE (2). This coordinates data isstored in the coordinates data memory 81 b, and the application nozzle18 moves along the first application line L1 and second application lineL2. The speed pattern is stored in the speed pattern memory 81 a.

In this application pattern, volume of the paste to be applied on thefirst and second application lines L1 and L2 is calculated based on thedata on the size of application area 6 a and paste thickness determinedby the chip size, and this application volume is stored in theapplication volume memory 79. The dispensing flow rate data calculatedfrom this application volume and application time is stored in thedispensing flow rate memory 80.

Application operation is described next. After positioning the leadframe 6 on the paste application unit 9, the application nozzle 18 ismoved to the application start point PS (1) to start dispensing thepaste by lowering the application nozzle 18 to a predetermined nozzleheight. The paste is dispensed in response to a command from thecontroller 67. The dispenser controller 60 drives the dispenser 16 andthe dispensing control valve driver 61 drives the dispensing controlvalve 19 to open the application opening 57. The dispenser 16 dispensesthe paste at the predetermined dispensing flow rate stored in thedispensing flow rate memory 80 to pressure feed the paste to theapplication nozzle 18. This enables the application of a predeterminedvolume of the paste on each application line.

The application nozzle 18 moves toward the application end point PE (1)while dispensing the paste, and stops dispensing the paste when theapplication nozzle 18 reaches the application end point PE (1). Theapplication nozzle 18 then moves to the application start point PS (2)of the application line L2 while stopping dispensing the paste (Refer tothe broken arrow 100 in FIG. 6). The paste is dispensed again until theapplication end point PE (2). The application nozzle 18 stops dispensingthe paste at this point and rises. This completes the paste applicationfor one application area 6 a.

In this paste application process, the following significant effects aredesired by applying paste using the above application nozzle 18. First,the transfer speed can be made faster to achieve high-speed plotting andimprove application efficiency by moving only the light and compactapplication nozzle 18.

The opening unit built into the application nozzle 18 providedimmediately before the application opening 57 opens and closes theapplication opening 57 for dispensing or stopping the paste 7 from theapplication nozzle 18. This achieves extremely fast response whendispensing or stopping the paste. In addition, the stem 54 rises in thesecond space 56 provided immediately before the application opening 57in the closing operation to stop dispensing. Accordingly, the paste 7 inthe second space 56 is securely pulled back to stop dispensing from theapplication opening 57. This prevents the stringing phenomenon whichoccurs when dispensing a small portion of the paste after the dispensingstop command is given, which occurs in a conventional dispenser.Accordingly, the present invention enables the accurate control of pastedispensing start and stop for each application line, even forcomplicated plotting patterns.

Conventionally, one-stroke plotting is adopted for preventing defectiveapplication due to stringing of the paste. However, this results inincreased application time because the dispensing opening follows thesame application line several times. The present invention eliminatesthis disadvantage, and enables the plotting of more complicatedapplication patterns in a shorter time. In addition, sincerapid-response start and stop operation of dispensing is ensured, thereis no need for extra stabilization time at the start and end points ofapplication. Accordingly, the application nozzle 18 ensures highlyefficient plotting application as well as high transfer speed.

In order to efficiently and accurately apply paste as described above,it is desirable to set the appropriate application pattern for each chipto be bonded. However, the preferred embodiment of the present inventionrequires the operator to simply specify a chip model when setting anapplication pattern, as described above. An appropriate pasteapplication pattern for specified model is then set, and the paste isdispensed and the application nozzle moves in accordance with thisselected pattern. Accordingly, the present invention eliminates the needfor painstaking setting of data for each chip model, which may berequired in the prior art, and thus improves operability of the pasteapplicator for chip bonding. At the same time, the setting of anappropriate application pattern secures high application quality.

The present invention calculates the dispensing flow rate of thedispenser based on data on application volume and data on applicationpattern of the paste applied to a substrate by the dispensing flow ratecalculator, and controls the transfer table on which the dispenser andapplication nozzle move based on this calculated dispensing flow rateand data on application pattern. This improves operability of the pasteapplicator for chip bonding. High application quality is thus securableby always assuring appropriate a setting of application patterns.

REFERENCE NUMERALS

1 chip feeder

2 wafer sheet

3 chip

4 bonding head

4 a nozzle of the bonding head 4

5 carrier

6 lead frame

6 a application area

7 paste

8 bonding position

9 paste application unit

10 transfer table

11 Y axis table

11 a Y axis motor

12 X axis table

12 a X axis motor

13 bracket

14 Z axis table

14 a Z axis motor

15 bracket

16 dispenser

17 tube

18 application nozzle

18 a nozzle block

18 b cover member

19 dispensing control valve

20 air tube

21 fixed plate

25 manifold block

26 syringe

26 a lower end of the syringe 26

27 inner hole

27 a space

27 b inner hole

28 reciprocating mechanism

29 stem

29 a sealing face

30 sealing member

31 space

31 b inner hole

32 piston

33 sealing member

34 holding member

35 motor

36 feeding screw

37 nut

38 inner hole

39 reciprocating mechanism

40 stem

40 a sealing face

42 dispensing opening

43 air source

44 control valve

50 cylinder

51 joint

52 spring

53 stepped inner hole

53 a first space

53 b clearance

53 c valve sheet

54 valve stem

54 a piston

54 b sealing face

55 joint

56 second space

57 application opening

60 dispenser controller

61 dispensing control valve driver

62 Z axis motor driver

63 Y axis motor driver

64 X axis motor driver

65 bonding head driver

66 memory

67 controller

68 control panel

69 display

70 first memory

71 nozzle size data memory

72 paste thickness data memory

73 chip size data memory

74 application pattern data memory

74 a reference coordinates data

74 b reference speed pattern

75 application volume calculator

76 application pattern setting unit

76 a magnifying and reducing processor

76 b application pattern selector

77 input processor

78 second memory

79 application volume memory

80 dispensing flow rate memory

80 a a speed pattern memory

81 application pattern memory

81 a a speed pattern memory

81 b b coordinates data memory

82 display processor

83 dispensing flow rate calculator

84 application speed calculator

85 evaluation unit

86 transfer table controller

100 broken arrow

c coordinates data

t application time

u application speed

v speed pattern

Vmax maximum transfer speed

L1 first application line

L2 second application line

PS (1), PS (2) application start point

PE (1), PE (2) application end point

TP paste thickness

What is claimed is:
 1. A paste application method for die bonding inwhich paste dispensed from a dispenser is pressure fed to an applicationnozzle, and a predetermined volume of the paste is dispensed from anapplication opening of said application nozzle based on stored data onsaid dispensing volume of said paste onto a substrate in a storedpredetermined application pattern for adhering a semiconductor chip onsaid substrate, said paste application method comprising: calculating adispensing flow rate of said paste based on data on said dispensingvolume of said paste to be applied to said substrate and data on saidapplication pattern; and moving said application nozzle based on saidcalculated dispensing flow rate and data on said application pattern.